The "14th Five-Year Plan for Digital Economy Development" issued by the S tate Council emphasizes the acceleration of digital industrialization and the enhancement of key technological innovation capabilities in strategic and forward-looking areas such as sensors. Responding to this national call, GOPRO focuses on 3D integrated packaging of semiconductor optical sensors for biometric recognition and ranging, providing sensing product solutions for scenarios such as artificial intelligence, the Internet of Things, and 5G.

» Industry Status and Advantages

◆ With 29 years of technological expertise in infrared applicati ons, our product defect rate is as low as 1PPM (one per million), reaching an internationally advanced level.

◆ Our laminated composite packaging technology for semiconductor optical sensors addresses key technological bottlenecks and fills a domestic gap.

◆ Domestic firsts: We were the first to apply in-vivo fingerprint re cognition to smart phones and the first to introduce infrared touch sensors.

◆ Awarded the "2019 China International Internet of Things Indus try Award - Innovation Award" and the "China (International) Internet of Things Leading Brand Award".

» Sensor Product Line

» Application Fields