Recently, Gopro has issued an announcement titled "Announcement on Changing the Use of Part of the Raised Funds and Adding New Investment Projects with Raised Funds". The announcement introduces the addition of two new investment projects funded by the raised capital: the "R&D and Industrialization Project of Integrated Packaging and Testing for Semiconductor Optoelectronic Sensors" and the "Expansion Project of Overseas Intelligent Manufacturing Industrial Base". These projects aim to seize technological innovations and market opportunities, fully leverage Gopro's manufacturing strengths in advanced packaging of semiconductor optoelectronic sensors and its overseas business advantages, optimize industrial and production capacity layouts, and achieve the company's strategic upgrade.

1.R&D and Industrialization Project of Integrated Packaging and Testing for Optoelectronic Sensors

Strategically Positioning in Emerging Markets,Focusing on Breakthroughs,and Achieving Domestic Substitution

Gopro's years of expertise in sensor packaging and testing have ushered in significant strategic opportunities in strategically emerging industries. Relying on its solid manufacturing foundation, groundbreaking leading technologies, iconic customers, profound R&D capabilities, and ecological chain synergy effects, the company promptly expands its production capacity for integrated packaging and testing of semiconductor optoelectronic sensors, swiftly responding to the rapid growth demands of markets such as autonomous driving, drones, robots, artificial intelligence, and intelligent health monitoring, as well as strategic customers.

2.Expansion Project of Overseas Intelligent Manufacturing Industrial Base

Improving the Global Industrial Chain Layout and Boosting Overseas Core Business Growth

Overseas business is one of the key focuses of Gopro's development. In 2019, Gopro established an overseas production base in Malaysia, formed a localized and international management team, and accumulated experience in overseas intelligent manufacturing management, laying a solid foundation for the expansion of overseas bases and achieving breakthroughs in overseas markets.

Driven by national policy incentives and strong demand from overseas strategic customers, Gopro further optimizes its domestic and international industrial layout and plans to expand its overseas intelligent manufacturing production base in Malaysia, focusing on the production capacity of semiconductor sensor modules and Sensor+, smart lighting, and smart integrated equipment. This expansion will further optimize overseas product mix and production capacity layout, enhance overseas industrial chain support capabilities, tap new growth points for overseas business, and promote the rapid development of international business.

With its new round of strategic upgrade, Gopro will seize the opportunity presented by the integrated packaging and testing of semiconductor optoelectronic sensors and the expansion of overseas intelligent manufacturing bases to forge a collaborative development of upstream and downstream industrial chains, meeting the dual demands of domestic and international markets. In the future, Gopro will continue to keep a close eye on the development trends of emerging industries, integrating technological innovation, resource integration, and capital operation to build a robust closed-loop industrial ecosystem.